High-precision double-side lapping and polishing platform
The Okamoto GNX series is engineered for demanding double-side lapping and polishing applications, delivering high dimensional accuracy, stable throughput and repeatable surface quality. Designed for semiconductor wafers and advanced materials, GNX machines integrate rigid construction, precise spindle control and optimized process stability to ensure uniform stock removal and superior flatness across a wide range of part sizes. Their automation-ready architecture and reliable performance suit both high-volume production and precision manufacturing environments.
| GNX200B | GNX300B | |
|---|---|---|
| Maximum machining diameter | 200 mm | 300 mm |
| Spindle speed range | 0–3600 rpm | 0–3000 rpm |
| Spindle drive motor power | 2.2 / 4 kW | 5.5 / 4 kW |
| Main shaft feed speed range | 1–999 µm/min | 1–999 µm/min |
| Number of spindles | 2 | 2 |
| Working disc speed range | 1–300 rpm | 1–300 rpm |
| Grinding wheel size | 250 mm | 300 mm |
| Equipment weight | 3900 kg | 5700 kg |
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