Automatic final polisher for 300 mm wafers maximizing edge-profile accuracy and removal-rate uniformity
A final polisher that adopts a specially structured polishing head and transport mechanism, enabling stable wafer processing with high precision and high throughput.
| Maximum wafer size | Ø300 mm |
| Wafers processed simultaneously | 10 |
| Polishing tables / stages | 3 tables, 6 wafers polished at once |
| Transport method | Indexing transport, 4 wafers moved at once |
| Application | Silicon wafer final polishing |
Key features
- Best-selling 300 mm final polisher
- Achieves atomic-level ultra-mirror, ultra-high-brightness polishing
- Three polish tables simultaneously polish six wafers from intermediate to finishing stages, with an indexing transport system moving four wafers at a time
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The Okamoto GNX series is engineered for demanding double-side lapping and polishing applications, delivering high dimensional accuracy, stable throughput and repeatable surface quality. Designed for semiconductor wafers and advanced materials, GNX machines integrate rigid construction, precise spindle control and optimized process stability to ensure uniform stock removal and superior flatness across a wide range of part sizes. Their automation-ready architecture and reliable performance suit both high-volume production and precision manufacturing environments.