SPP600S
Polishing machine, equipped with a wide range of software for research and development
User-friendly CMP equipment designed with ease of use and environmental considerations in mind.
| SPP600S | SPP800S | SPP1000S | SPP1200S | |
|---|---|---|---|---|
| Max. workpiece / wafer size | Ø200 mm | Ø300 mm | Ø300 mm | Ø450 mm |
| Max. wafer size | 4″–12″ | 4″–12″ | N/A | N/A |
| Platen diameter | Ø600 mm | Ø800 mm | Ø1000 mm | Ø1200 mm |
| Wafers processed simultaneously | 2 | 2 | 2 | 2 |
| Platen rotation speed | 10–80 min⁻¹ | 10–80 min⁻¹ | N/A | 10–80 min⁻¹ |
| Footprint W × D × H | 1380 × 1110 × 1873 mm | 1755 × 1200 × 2086 mm | N/A | N/A |
| Machine weight | 2100 kg | 3000 kg | N/A | N/A |
Key features
- Manual-type CMP system ideal for R&D applications, supporting various pressure-control methods based on either the front or back surface, with all processing conditions monitored on a single screen
- Primary time settings ensure consistently stable data collection; data can be linked with the fully automatic polisher PNX332B and used directly
- Wafer shape is not compromised even at removal rates of 10 μm or more; features a dedicated dresser spindle compatible with diamond dressers, plus a slurry-recycling mechanism
Related models
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