SVG401H
Space-saving and multi-functional grinding machine
High-rigidity grinder ideal for machining difficult-to-cut materials such as sapphire, SiC and compound semiconductors.
No technical specification table was published for this model.
Key features
- Manual grinder for research & development and grinding of difficult-to-cut materials; the related SVG101 model features a shuttle table designed for manual wafer loading and unloading
- Performs continuous machining of difficult-to-cut materials such as sapphire and SiC, and compound semiconductors, using its high-rigidity structure and high-horsepower built-in motor
- For batch processing of small-diameter wafers, a chuck table supporting up to 450 mm diameter can be installed (20-wafer batches of 3-inch wafers)
